合肥芯碁微電子裝備
合肥芯碁微電子裝備
💡 定價範圍HK$240.09–252.73
Offer Price
HK$252.73
Market Cap
HK$30.8B
Listing Date
2026-06-27
Sector
半導體設備
📊 Valuation Analysis
P/S ratio
24.1x
合理 — 接近行業平均半導體設備 sector P/S benchmark: 15x – 25x
Revenue growth (YoY)
47.6%
Gross margin
39.1%
Net margin
20.6%
Profitability
Profitable
Fair value range by sector P/S benchmark: HK$157.09 – HK$261.81
💰 Financial Summary (FY2025)
Revenue
RMB14.08B
Prior revenue
RMB9.54B
Gross profit
RMB5.51B
Net profit
RMB2.90B
Figures in RMB (some companies converted from their prospectus reporting currency — see notes below).
🏢 Company Overview
合肥芯碁微電子裝備股份有限公司，全球最大的PCB直接成像(DI)設備供應商，2025年全球市佔率18.8%。核心產品為激光直接成像設備（LDI）及自動光學檢測設備(AOI)，廣泛應用於PCB線路板、IC載板（ABF/BT載板）、先進封裝及平板顯示等高端製造環節。公司在A股（科創板）上市後，現發行H股實現雙重上市。客戶覆蓋全球前20大PCB製造商中的15家，包括鵬鼎控股、欣興電子、AT&S、深南電路等，設備出口至台灣、韓國、日本、泰國等市場。
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⚠️ For educational reference only and not investment advice. IPO pricing, listing dates and financial data are subject to change — always refer to HKEX announcements and the prospectus. Investing involves risk.