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02249半導體2026-07-10 · Listed
Nexchip Semiconductor Corporation
晶合集成
💡 上市價
Offer Price
HK$32.30
Market Cap
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Listing Date
2026-07-10
Sector
半導體
Financial data pending — valuation analysis not yet available.
💰 Financial Summary (FY2025)
Revenue
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Prior revenue
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Gross profit
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Net profit
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Figures in RMB (some companies converted from their prospectus reporting currency — see notes below).
📝 Key Notes
晶圓代工（顯示驅動芯片DDIC）。數據待補：總股數、財務數據。
🏢 Company Overview
晶合集成（Nexchip），中國領先的晶圓代工企業，專注顯示驅動芯片（DDIC）及特殊工藝代工，以合肥12吋晶圓產線為核心，服務全球顯示面板及消費電子客戶。
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⚠️ For educational reference only and not investment advice. IPO pricing, listing dates and financial data are subject to change — always refer to HKEX announcements and the prospectus. Investing involves risk.